{"id":5050,"date":"2021-12-28T23:56:00","date_gmt":"2021-12-28T15:56:00","guid":{"rendered":"https:\/\/www.granitefirm.com\/blog\/us\/?p=5050"},"modified":"2026-04-24T20:04:25","modified_gmt":"2026-04-24T12:04:25","slug":"tsmc-process-roadmap","status":"publish","type":"post","link":"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/","title":{"rendered":"Comparison of SMIC, Rapidus, TSMC, Intel, and Samsung\u2019s new process roadmaps for future chips"},"content":{"rendered":"\n<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_82_2 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table of Contents<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\"><span class=\"ez-toc-js-icon-con\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #ffffff;color:#ffffff\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #ffffff;color:#ffffff\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/span><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1 ' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Foreword\" >Foreword<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#A_comparison_table_is_needed\" >A comparison table is needed<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Source\" >Source<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Update_frequency\" >Update frequency<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Companion_posts_to_this_article\" >Companion posts to this article<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#TSMC_discussion_in_my_books\" >TSMC discussion in my books<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#New_process_schedules_for_future_chips\" >New process schedules for future chips<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Schedule_comparison_for_future_nodes\" >Schedule comparison for future nodes<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Schedule_comparision_of_past_nodes\" >Schedule comparision of past nodes<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Intel\" >Intel<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Samsung\" >Samsung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#TSMC\" >TSMC<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Why_the_table_matters\" >Why the table matters?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#The_deployment_of_GAA\" >The deployment of GAA<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Transistor_density_comparison\" >Transistor density comparison<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Four_vendors_head-to-head\" >Four vendors head-to-head<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Intel-2\" >Intel<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Samsung-2\" >Samsung<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#SMIC\" >SMIC<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#What_about_2_nanometer_and_below\" >What about 2 nanometer and below ?<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Technical_challenges\" >Technical challenges<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Actions_of_major_manufacturers\" >Actions of major manufacturers<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-23\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#What_about_the_yield_comparison\" >What about the yield comparison?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-24\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/#Related_articles\" >Related articles<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Foreword\"><\/span>Foreword<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"A_comparison_table_is_needed\"><\/span>A comparison table is needed<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>I often see many people discussing the five companies SMIC (ticker: SIUIF), Rapidus (unlisted), Intel (ticker: INTC), Samsung (ticker: SSNLF), and TSMC (ticker: TSM). The timing of advanced processes, but few people have better integrated the timing of these companies, that is, a comparison table is needed to make it clearer. This is the original intention of writing this article.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Source\"><\/span>Source<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>My main sources of information are: <\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Public information published by these five companies. <\/li>\n\n\n\n<li>Information published by media around the world.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Update_frequency\"><\/span>Update frequency<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Since there are more than tens of thousands of&nbsp;people readers following this article from around the world, I will update this post as often as possible.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Companion_posts_to_this_article\"><\/span>Companion posts to this article<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Readers who will read this article, I guess you will be very interested in the sister post of this post you are reading now. You are welcome to click &#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/\" target=\"_blank\" rel=\"noreferrer noopener\">Comparison of SMIC, Rapidus, TSMC, Intel, and Samsung\u2019s new process roadmaps for future chips<\/a>&#8220;, &#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/05\/13\/yield-rate-comparison\/\" target=\"_blank\" rel=\"noreferrer noopener\">Yield rate comparison of SMIC, Rapidus, TSMC, Samsung, Intel&#8217;s advanced process<\/a>&#8220;, &#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/10\/01\/how-many-fab-does-tsmc-have\/\" target=\"_blank\" rel=\"noreferrer noopener\">How many fabs and houses does TSMC have currently and in the future?<\/a>&#8221; and&#8221;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2023\/04\/29\/cost-of-chip-foundry\/\">The TSMC cost, sell price, and R&amp;D cost of chip foundry<\/a>&#8220;<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"TSMC_discussion_in_my_books\"><\/span>TSMC discussion in my books<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>I have discussed the company Nvidia (ticker:NVDA) in two recent books; including:<\/p>\n\n\n\n<p>In my book &#8220;<a href=\"https:\/\/www.books.com.tw\/products\/0010889106?sloc=main\" target=\"_blank\" rel=\"noreferrer noopener\">The Rules of Super Growth Stocks Investing<\/a>&#8220;:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Sections 2-4, the entire section is dedicated to introducing the company TSMC<\/li>\n\n\n\n<li>Section 3-3, analyze the business development of technology companies to grasp the pulse of key industries<\/li>\n<\/ul>\n\n\n\n<p>In my book &#8220;<a href=\"https:\/\/www.books.com.tw\/products\/0010935641?sloc=main\" target=\"_blank\" rel=\"noreferrer noopener\">The Rules of 10 Baggers<\/a>&#8220;:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Section 3-2, the entire section is dedicated to introducing TSMC and the global semiconductor supply chain.<\/li>\n<\/ul>\n\n\n\n<p>Recently, I have seen several articles discussing Intel\u2019s and TSMC\u2019s process comparison schedules. Many of them are not bad, but they are too deep dive. I want to pick the most important ones. In addition to the previous public information released by Intel (ticker: INTC), Samsung (ticker: SSNLF), and TSMC (ticker: TSM), I will organize it for interested investors and write this article that you see. Regarding Intel&#8217;s progress, everyone is very concerned, here are <a href=\"https:\/\/www.intel.com\/content\/www\/us\/en\/newsroom\/news\/intel-technology-roadmaps-milestones.html\" target=\"_blank\" rel=\"noreferrer noopener\">the official official documents of Intel<\/a> for reference.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"New_process_schedules_for_future_chips\"><\/span><strong>New process schedules for future chips<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Schedule_comparison_for_future_nodes\"><\/span>Schedule comparison for future nodes<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table><tbody><tr><td><\/td><td>2024<\/td><td>2025<\/td><td>2026<\/td><td>2027<\/td><td>2028<\/td><td>2029<\/td><td>2030<\/td><\/tr><tr><td>TSMC<\/td><td>2nm  (GAA) pilot run<\/td><td>2nm  (GAA)  <\/td><td>1.6nm  (GAA) <\/td><td><\/td><td>1.4nm (GAA)<\/td><td>1.0nm, 1,2nm, 1.3nm<\/td><td><\/td><\/tr><tr><td>Samsung<\/td><td><\/td><td>2nm  (GAA)  <\/td><td><\/td><td><\/td><td>1.4nm<\/td><td><\/td><td>1.0nm<\/td><\/tr><tr><td>Intel<\/td><td>Cancelled officially<\/td><td>1.8nm <\/td><td><\/td><td>1.4nm, 1.0nm start to develop<\/td><td><\/td><td>1.0nm <\/td><td><\/td><\/tr><tr><td>SMIC<\/td><td><\/td><td>5nm<\/td><td><\/td><td><\/td><td><\/td><td><\/td><td><\/td><\/tr><tr><td>Rapidus<\/td><td><\/td><td><\/td><td><\/td><td>2nm<\/td><td><\/td><td>1.4nm<\/td><td><\/td><\/tr><\/tbody><\/table><figcaption class=\"wp-element-caption\">Based on TSMC, Samsung, and Intel&#8217;s offical data<\/figcaption><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Schedule_comparision_of_past_nodes\"><\/span>Schedule comparision of past nodes<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table><tbody><tr><td><\/td><td>2018<\/td><td>2019<\/td><td>2020<\/td><td>2021<\/td><td>2022<\/td><td>2023<\/td><\/tr><tr><td>TSMC<\/td><td>7nm <\/td><td><\/td><td>6nm, 5nm<\/td><td>4nm<\/td><td>3nm  (FinFET)<\/td><td>3nm+ (FinFET)<\/td><\/tr><tr><td>Samsung<\/td><td>8nm<\/td><td><\/td><td>5nm, 4nm<\/td><td><\/td><td>3nm  (GAE) <\/td><td>3nm+  (GAA)  <\/td><\/tr><tr><td>Intel<\/td><td><\/td><td>Intel 10<\/td><td><\/td><td>Intel 7<\/td><td>Intel 4 (2H of 2022), Intel 18A (pilot run)<\/td><td>Intel 3(2H of 2023)<\/td><\/tr><\/tbody><\/table><figcaption class=\"wp-element-caption\">Based on TSMC, Samsung, and Intel&#8217;s offical data<\/figcaption><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Intel\"><\/span>Intel<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Please note the following three points:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>After Intel&#8217;s new CEO Gelsinger took office this year, he launched the IDM 2.0 plan to return to semiconductor foundry business, and Intel changed its process naming rules in 2021. Because its naming method in the past is easy to misunderstand (Please refer to the table comparison table in the &#8220;Transistor Density Comparison&#8221; section below, you will understand why), for example:\n<ul class=\"wp-block-list\">\n<li>Intel&#8217;s 10nm was actually equal to TSMC and Samsung&#8217;s 7nm<\/li>\n\n\n\n<li>Intel&#8217;s 7nm was actually equal to TSMC and Samsung&#8217;s 5nm<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>And now\n<ul class=\"wp-block-list\">\n<li>Intel 7, that is Intel&#8217;s 4nm, use Enhanced SuperFin<\/li>\n\n\n\n<li>Intel 4, that is Intel&#8217;s 3nm (use GAE) <\/li>\n\n\n\n<li>Intel 3, that is Intel&#8217;s 3nm (use GAA) <\/li>\n\n\n\n<li>Intel 20A is Intel&#8217;s 2nm; where A means angstroms, and 10 angstroms equals 1 nanometer. <\/li>\n\n\n\n<li>Intel 18A is also Intel&#8217;s 2nm (2nm&#8217;s enhanced version)<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Intel 4 will be mass-produced in the first half of 2023, and Intel 3 will be mass-produced in the second half of 2023. <\/li>\n\n\n\n<li>Intel publicly announced on 4\/24\/2022 that it will bring forward all future advanced process plans, saying:<ul><li>4nm launch in the second half of 2022<\/li><\/ul>\n<ul class=\"wp-block-list\">\n<li>3nm launch in 2023<\/li>\n\n\n\n<li>20A (2nm) production in early 2024<\/li>\n\n\n\n<li>18A (1.8nm) in the second half of<\/li>\n\n\n\n<li>14A (1.4nm) will be in 2026<\/li>\n\n\n\n<li>10A (1.0nm) will be in 2027<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Samsung\"><\/span>Samsung<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Samsung&#8217;s 3-nanometer timeframe:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Samsung&#8217;s first 3-nanometer has been successfully developed and was production in second quarter of 2022<\/li>\n\n\n\n<li>The improved version of 3-nanometer (aka 3nm+) mass production schedule has been extended to 2023, according to Samsung&#8217;s official statement, which is one year behind TSMC; this will seriously damage Samsung&#8217;s wafer foundry business.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"TSMC\"><\/span>TSMC<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Although it has been repeatedly reported that it has encountered technical problems and yield problems, TSMC&#8217;s 3nm commercial mass production time has been officially reconfirmed by TSMC to be in the second half of 2022.<\/p>\n\n\n\n<p>TSMC CEO C.C. Wei said in October 2023 that based on TSMC\u2019s internal evaluation, TSMC\u2019s latest 3-nanometer extension model is comparable to Intel\u2019s 18A in terms of power, performance and density.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Why_the_table_matters\"><\/span><strong>Why the table matters?<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Compare the schedule table of the above three manufacturers&#8217; process roadmap:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Intel has mass-produced Intel 7 in 2021, which is equivalent to TSMC&#8217;s 7nm. TSMC has already mass-produced in 2018, which is three years behind.<\/li>\n\n\n\n<li>In the first half of 2023, Intel 4 will be mass-produced, which is equivalent to TSMC&#8217;s 4nm. TSMC has already mass-produced in 2020, which is about two and a half years behind.<\/li>\n\n\n\n<li>By 2023, Intel plans to mass-produce Intel 3, which is equivalent to TSMC&#8217;s 3nm, and TSMC will mass-produce its 3nm in 2022. At this time, Intel is almost one year behind.<\/li>\n\n\n\n<li>When it comes to the 2nm process, Intel plans to catch up with TSMC&#8217;s 2nm process schedule in 2024, a year in advance. This also means that it is very difficult to update the technology on the next-generation process just in one year. TSMC generally upgrades the next-generation technology in two years. Specially , Intel still has room for improvement in the yield rate, or it is still possible delayed. Moreover, according to Intel&#8217;s repeated backwardness in manufacturing processes in the past, the industry generally does not believe that Intel is capable of make it.<\/li>\n<\/ul>\n\n\n\n<p>I previously emphasized the following two points in my previous article <span style=\"font-size: revert;\">&#8220;<\/span><a style=\"font-size: revert;\" href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/11\/05\/intels-current-difficult-dilemma\/\">Intels current difficult dilemma<\/a><span style=\"font-size: revert;\">&#8220;<\/span> :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Intel and TSMC have at least two generations of semiconductor process gaps. &#8220;Even if the best, everything goes smoothly,&#8221; it will not be possible without 4 to 5 years for Intel to fill the gaps.<\/li>\n\n\n\n<li>&#8220;First, make up for the process gap behind TSMC, and talk more about the rest.&#8221;<\/li>\n<\/ul>\n\n\n\n<p><strong>Note<\/strong>: no surprises! After I have published this article; On December 10, 2021, Intel\u2019s CEO Gelsinger believes that it will take at least five years for the company to turnaround, which is the same as my opinion. This is not a secret, the industry insiders or Wall Street&#8217;s more senior semiconductor analysts also think so.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"The_deployment_of_GAA\"><\/span><strong>The deployment of GAA<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>GAA (Gate All Around) is the core technology of the next generation of chip manufacturing. Generally speaking, TSMC is the last of the three to deploy it, and it was first introduced at TSMC&#8217;s 2nm process. The following is the time schedule for the three manufacturers to deploy GAA, and the comparison table of the imported nodes:<\/p>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-1 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\">\n<div class=\"wp-block-group\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<figure class=\"wp-block-table is-style-regular\"><table class=\"has-fixed-layout\"><tbody><tr><td><\/td><td>GAA name<\/td><td>Process<\/td><td>Schedule<\/td><\/tr><tr><td>Intel<\/td><td>RobbonFET<\/td><td>20A<\/td><td>2024<\/td><\/tr><tr><td>Intel<\/td><td>RobbonFET <\/td><td>18A<\/td><td>2025<\/td><\/tr><tr><td>TSMC<\/td><td>GAAFET<\/td><td>N2\/2nm<\/td><td>2025<\/td><\/tr><tr><td>Samsung<\/td><td>MCBFET<\/td><td>3GAE<\/td><td>2022<\/td><\/tr><tr><td>Samsung<\/td><td>MCBFET <\/td><td>3GAP<\/td><td>2023<\/td><\/tr><\/tbody><\/table><\/figure>\n<\/div><\/div>\n<\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Transistor_density_comparison\"><\/span><strong>Transistor density comparison<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Four_vendors_head-to-head\"><\/span>Four vendors head-to-head<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>By the end of 2021, the data published by each company will be the main basis. The following table is from WikiChip, and the unit of value is millions of transistors\/square meter.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table><tbody><tr><td>Process name<\/td><td>IBM<\/td><td>TSMC<\/td><td>Intel<\/td><td>Samsung<\/td><\/tr><tr><td>22nm<\/td><td><\/td><td><\/td><td>16.50<\/td><td><\/td><\/tr><tr><td>16nm\/14nm <\/td><td><\/td><td>28.88<\/td><td>44.67<\/td><td>33.32<\/td><\/tr><tr><td>10nm <\/td><td><\/td><td>53<\/td><td>106<\/td><td>52<\/td><\/tr><tr><td>7nm<\/td><td><\/td><td>97<\/td><td>180<\/td><td>95<\/td><\/tr><tr><td>5nm<\/td><td><\/td><td>173<\/td><td>300<\/td><td>127<\/td><\/tr><tr><td>3nm<\/td><td><\/td><td>290<\/td><td>520<\/td><td>170<\/td><\/tr><tr><td>2nm\/20A<\/td><td>333.33<\/td><td>490<\/td><td><\/td><td><\/td><\/tr><\/tbody><\/table><figcaption class=\"wp-element-caption\">*Estimated Logic Density<\/figcaption><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Intel-2\"><\/span>Intel<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>In the previous section of &#8220;New process schedules for future chips&#8221;, we said that Intel\u2019s previous naming method is misleading. The reason is that you will understand if you use this table comparison table to explain:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Intel\u2019s 16nm\/14nm transistor is 44.67, which is roughly equivalent to TSMC\u2019s 52.51 of 10nm.<\/li>\n\n\n\n<li>Intel\u2019s 10nm transistor is 100.76, which is roughly equivalent to TSMC\u2019s 7nm transistor of 91.20<\/li>\n\n\n\n<li>Intel\u2019s 7nm transistor is 237.18, which is roughly equivalent to TSMC\u2019s 5\/4nm of 171.30<\/li>\n<\/ul>\n\n\n\n<p>You now know why since 7-8 years ago, Intel saw their own chip process advancement speed has been surpassed by TSMC and Samsung, and find out some words that made sense at the time and technically, &#8220;We Intel\u2019s 16nm \/14nm is equal to TSMC\u2019s 10nm.\u201d After another three or four years later, the statement became \u201cOur Intel\u2019s 10nm is equal to TSMC\u2019s 7nm\u201d, so we are not behind! Please note that at this time, it is actually about 1-1.5 generations behind TSMC.<\/p>\n\n\n\n<p>But when Intel\u2019s clich\u00e9s were moved out at this moment after 10 years, investors were fed up. Because it is not only one generation behind, it is 2-2.5 generations behind (In chip process generation, one generation is about 2-3 years behind), no matter how round it is, it cannot be justified.<\/p>\n\n\n\n<p>But everyone should pay special attention to this: Intel\u2019s schedule and yield rate in the market will be skeptical at first, because Intel\u2019s previous record is really not good\u2500\u2500Intel\u2019s 14nm process has been announced from successful trial production to Real customers can buy it in the market, and it has been delayed for 7 years (2014\u20132020). This is Intel&#8217;s biggest problem now!<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Samsung-2\"><\/span>Samsung<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>What about the Samsung part? Although Samsung&#8217;s 3nm has been successfully developed and a small part of commercial trial production has been successful. However, from the perspective of key indicators such as transistor density and power consumption, Samsung&#8217;s 3nm process is actually comparable to TSMC&#8217;s 4nm process and Intel&#8217;s Intel 4 (formerly Intel&#8217;s 7nm process).<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"SMIC\"><\/span>SMIC<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>&#8220;Nikkei&#8221; previously reported that Shimizu Yoji, president of semiconductor research company TechanaLye, said that SMIC&#8217;s strength is only three years behind TSMC. In particular, SMIC uses 7nm technology, but it has the same performance as TSMC&#8217;s 5nm technology, which represents mainland China&#8217;s semiconductor design capabilities have been further improved.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_about_2_nanometer_and_below\"><\/span><strong>What about 2 nanometer and below ?<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technical_challenges\"><\/span>Technical challenges<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The Belgian Microelectronics Research Center (IMEC) said that Moore&#8217;s Law will not end, but must be contributed by many parties. IMEC has proposed the semiconductor process technology and chip design path from 1 nanometer to 2 angstroms, continuing Moore&#8217;s Law. <\/p>\n\n\n\n<p>Currently, these efforts include:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Overall Architecture: FinFET Devices, Boards, Atomic Channel Devices<\/li>\n\n\n\n<li>New Materials: Using new materials, tungsten or molybdenum, to fabricate gates equivalent to a few atoms in length for 1-nanometer and 4-angstrom and 2-angstrom structures.<\/li>\n\n\n\n<li>A new generation of EUV extreme ultraviolet exposure machine: ASML&#8217;s new generation of High-NA EUV exposure machine has been introduced. Currently, customers are installing the prototype of the High-NA EUV exposure machine, which is expected to be put into commercial use in 2024. It is believed that exposure tools will extend Moore&#8217;s Law below the 1nm node.<\/li>\n\n\n\n<li>GAA Architecture: Starting at 2nm, the GAA architecture with stacked nanosheets is the most likely concept. The Forksheet architecture developed by IMEC can scale gates beyond 1nm.<\/li>\n<\/ul>\n\n\n\n<p>The key among them is ASML&#8217;s new generation of EUV extreme ultraviolet exposure machine. Regarding this company, I suggest you refer to my other blog article &#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/01\/15\/asml-who-really-caught-tsmcs-neck\/\" target=\"_blank\" rel=\"noreferrer noopener\">ASML, who dominate TSMC\u2019s fate<\/a>&#8220;.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Actions_of_major_manufacturers\"><\/span>Actions of major manufacturers<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The current processes below 1 nanometers are still in the &#8220;very early stage&#8221;, which is a period of research and exploration. Please refer to the following collation:<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table><tbody><tr><td>Company Name<\/td><td>Partners<\/td><td>Technologies and prelimilary announcement<\/td><\/tr><tr><td>TSMC<\/td><td>MIT<\/td><td>In June 2022, the original 3nm process R&amp;D team will be converted into a 1.4nm R&amp;D team.<br>In May, 2021, TSMC and MIT  announced that it will break through the limit of 1 nanometer process with bismuth metal characteristics, and reach below 1 nanometer.<\/td><\/tr><tr><td>Samsung<\/td><td>IBM<\/td><td>At IEDM 2021 event, IBM and Samsung co-announced VTFET chip design technology. Stacking the transistors in a vertical manner and allowing the current to flow vertically also increases the number density of transistors again, greatly improves the efficiency of power use, and breaks the bottleneck of the 1 nanometer process.<\/td><\/tr><tr><td>Intel<\/td><td><\/td><td>Ready for mass production of 1.8nm process in the second half of 2024<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"206\" height=\"127\" src=\"https:\/\/www.granitefirm.com\/blog\/us\/wp-content\/uploads\/sites\/2\/2022\/07\/Schedule.png\" alt=\"process \" class=\"wp-image-11795\"\/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_about_the_yield_comparison\"><\/span>What about the yield comparison?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>I post another article on my blog about the advanced process and the yield rate of these three companies. Please refer to the article &#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/05\/13\/yield-rate-comparison\/\" target=\"_blank\" rel=\"noreferrer noopener\">Yield rate comparison of SMIC, Rapidus, TSMC, Samsung, Intel&#8217;s advanced process<\/a>&#8220;.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Related_articles\"><\/span>Related articles<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li><a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2026\/03\/23\/tsmc-ceo-appalling-remarks\/\">&#8220;TSMC CEO appalling remarks on Chinese robots, inferiority to nVidia Huang<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2026\/04\/04\/skywater-3d-chip-us-foundry\/\">SkyWater, 3D chip leader and the only pure-play US chip foundry<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2025\/09\/22\/chang-refuted-by-yeh\/\">Morris Chang refuted by Yeh Wanan, Taiwan was unwilling to invest in TSMC<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2025\/09\/10\/chip-war-talk-about\/\">What does book &#8220;Chip War&#8221; talk about?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2025\/05\/05\/semiconductor-to-taiwan\/\">How important is semiconductor industry to Taiwan?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2025\/04\/13\/china-mature-process\/\">China is monopolizing world&#8217;s chip mature process<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2025\/03\/08\/smic-after-us-embargo\/\">How is SMIC after US embargo?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2025\/03\/16\/risks-and-disadvantages\/\">TSMC risks and disadvantages in Taiwan<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2025\/03\/02\/tsmc-moat-competitiveness\/\">165 billions investment proved TSMC moat and competitiveness is fragile<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2025\/02\/06\/tsmc-originally-founded\/\">How was TSMC originally founded? Not by Morris Chang<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2025\/02\/16\/why-was-asml-founded\/\">Why was ASML founded?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/12\/28\/morris-changs-controversial\/\">TSMC Morris Chang&#8217;s controversial words and deeds<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2025\/01\/05\/semiconductor-packaging-2\/\">TSMC is becoming the lord of semiconductor packaging, in addition to foundry<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/10\/21\/abandoned-nuclear-hit-tsmc\/\">Taiwan&#8217;s abandoned nuclear hit TSMC hard, profit margins decrease 1% by electricity price increase<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/10\/02\/rapidus-tsmcs-rival\/\">Rapidus will be TSMC&#8217;s strongest rival in the future<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/05\/13\/yield-rate-comparison\/\" target=\"_blank\" rel=\"noreferrer noopener\">Yield rate comparison of SMIC, Rapidus, TSMC, Samsung, Intel&#8217;s advanced process<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/12\/28\/tsmc-process-roadmap\/\" target=\"_blank\" rel=\"noreferrer noopener\">Comparison of SMIC, Rapidus, TSMC, Intel, and Samsung\u2019s new process roadmaps for future chips<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/09\/06\/what-are-silicon-photonics\/\" target=\"_blank\" rel=\"noreferrer noopener\">What are silicon photonics? Why it&#8217;s important? and current progress<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/10\/02\/rapidus-tsmcs-rival\/\">Rapidus will be TSMC&#8217;s strongest rival in the future<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/09\/28\/how-does-onto-make-money\/\">How does Onto make money? Advanced packaging beneficiary<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/07\/10\/mong-song-liang\/\" target=\"_blank\" rel=\"noreferrer noopener\">Mong-Song Liang, the hero of SMIC\u2019s breakthrough in US blockade<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2025\/01\/09\/tsmc-valuation\/\">Why is TSMC valuation much lower than US peers?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2023\/11\/30\/tsmc-negative-corp-culture\/\" target=\"_blank\" rel=\"noreferrer noopener\">TSMC negative toxic corp culture and management style are detrimental to its future and growth<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/04\/10\/four-chip-companies\/#google_vignette\" target=\"_blank\" rel=\"noreferrer noopener\">Four chip companies account for one-third of S&amp;P 500 gains so far this year<\/a><\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/04\/06\/artificial-intelligence-listed-companies\/\" target=\"_blank\" rel=\"noreferrer noopener\">Top five lucrative artificial lucrative intelligence listed companies<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/04\/01\/tsmc-dcf-value\/\">What&#8217;s TSMC DCF intrinsic value?How to calculate it quickly with a free tool?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/10\/01\/how-many-fab-does-tsmc-have\/\" target=\"_blank\" rel=\"noreferrer noopener\">How many fabs and houses does TSMC have currently and in the future?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2023\/04\/29\/cost-of-chip-foundry\/\">The TSMC cost, sell price, and R&amp;D cost of chip foundry<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/01\/15\/asml-who-really-caught-tsmcs-neck\/\" target=\"_blank\" rel=\"noreferrer noopener\">ASML, who dominate TSMC\u2019s fate<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/07\/30\/two-long-term-threats-to-tsmc\/\" target=\"_blank\" rel=\"noreferrer noopener\">Two long-term threats to TSMC: US and SMIC<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/06\/30\/tsmcs-profit-margin\/\" target=\"_blank\" rel=\"noreferrer noopener\">Why is TSMC\u2019s profit margin much greater than competitors?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/08\/13\/how-does-tsmc-make-money\/\" target=\"_blank\" rel=\"noreferrer noopener\">How does TSMC make money?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/11\/02\/zyvex\/\" target=\"_blank\" rel=\"noreferrer noopener\">Zyvex and sub-nanometer semiconductor processes, will Zyvex threat TSMC?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2023\/01\/28\/tsmc-serious-crises\/\">TSMC gets emerging&nbsp;and serious challenges<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/06\/24\/nvidia-changes-gaming-rules\/\" target=\"_blank\" rel=\"noreferrer noopener\">How does nVidia make money, Nvidia is changing the gaming rules<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2023\/12\/11\/nvidias-monopoly\/\" target=\"_blank\" rel=\"noreferrer noopener\">The reasons for Nvidia\u2019s monopoly and the challenges it faces<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/01\/29\/arm-acquired-by-nvidia\/\">Why nVidia failed to acquire ARM?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2023\/07\/02\/revisiting-nvidia\/\">Revisiting Nvidia: The Absolute Leader in Artificial Intelligence, Data Center, and Graphics<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/09\/08\/gelsinger-impossible\/\" target=\"_blank\" rel=\"noreferrer noopener\">Gelsinger faces a impossible mission, time is running out<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/05\/25\/will-intel-go-bankrupt\/\" target=\"_blank\" rel=\"noreferrer noopener\">Will Intel go bankrupt?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/08\/31\/how-bad-is-intel\/\" target=\"_blank\" rel=\"noreferrer noopener\">How bad is Intel right now?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/06\/12\/intel-is-spinning-into-five\/\" target=\"_blank\" rel=\"noreferrer noopener\">Intel is spinning into five separate companies<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/05\/25\/will-intel-go-bankrupt\/\" target=\"_blank\" rel=\"noreferrer noopener\">Will Intel go bankrupt?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/10\/30\/how-does-intel-make-money-and-the-benefits-to-invest-in-it\/\">How does Intel make money? and the benefits to invest in it<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/11\/05\/intels-current-difficult-dilemma\/\">Intel&#8217;s current difficult dilemma<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/11\/22\/texas-instruments-bio\/\" target=\"_blank\" rel=\"noreferrer noopener\">How does Texas Instruments make money? Amazing long term capital reward and company net profit margin!<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/04\/22\/amd-make-money\/\" target=\"_blank\" rel=\"noreferrer noopener\">How AMD makes money? A rare case of turning defeat into victory<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/02\/05\/amd-jaw-dropping\/\" target=\"_blank\" rel=\"noreferrer noopener\">Why is AMD\u2019s performance so jaw-dropping?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/05\/01\/qualcomm-diversifies\/\" target=\"_blank\" rel=\"noreferrer noopener\">Qualcomm diversifies success, no nonger highly dependend on phone<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/01\/29\/how-arm-make-money\/\" target=\"_blank\" rel=\"noreferrer noopener\">How does the ubiquitous Arm make money?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/07\/23\/significant-changes-in-broadcoms-business-approach\/\" target=\"_blank\" rel=\"noreferrer noopener\">Significant changes in Broadcom\u2019s business approach<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2023\/03\/04\/data-center-a-rapidly-growing-semiconductor-field\/\">Data center, a rapidly growing semiconductor field<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/04\/18\/applied-materials\/\" target=\"_blank\" rel=\"noreferrer noopener\">How does Applied Materials, lord of semiconductor equipment, make money?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/08\/12\/lam-research-chip-equipment\/\" target=\"_blank\" rel=\"noreferrer noopener\">How does Lam Research, top chip equipment player, make money?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2021\/09\/25\/the-lucrative-semiconductor-industry\/\" target=\"_blank\" rel=\"noreferrer noopener\">The lucrative semiconductor supply chain<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/01\/25\/global-semiconductor-chip-market-in-detail\/\" target=\"_blank\" rel=\"noreferrer noopener\">Global semiconductor chip market in detail, big dominators and markets<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/05\/07\/semiconductor-investment\/\" target=\"_blank\" rel=\"noreferrer noopener\">6 common wrong semiconductor investment myths<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2022\/09\/23\/3rd-gen-semiconductor\/\" target=\"_blank\" rel=\"noreferrer noopener\">Gen 3 semiconductor<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2023\/06\/14\/eda-synopsys-cadence-mentor\/\">Three EDA oligopoly vendors: Synopsys, Cadence, and Siemens&#8217;s Mentor Graphics<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2024\/01\/22\/how-cadence-make-money\/\" target=\"_blank\" rel=\"noreferrer noopener\">How does, the EDA oligopoly, Cadence make money?<\/a>&#8220;<\/li>\n\n\n\n<li>&#8220;<a href=\"https:\/\/www.granitefirm.com\/blog\/us\/2023\/12\/22\/how-synopsis-make-money\/\" target=\"_blank\" rel=\"noreferrer noopener\">How does Synopsis, the EDA oligopoly, make money?<\/a>&#8220;<\/li>\n<\/ul>\n\n\n\n<p><em><strong>Disclaimer<\/strong><\/em><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><em>The content of this site is the author\u2019s personal opinions and is for reference only. I am not responsible for the correctness, opinions, and immediacy of the content and information of the article. Readers must make their own judgments.<\/em><\/li>\n\n\n\n<li><em>I shall not be liable for any damages or other legal liabilities for the direct or indirect losses caused by the readers&#8217; direct or indirect reliance on and reference to the information on this site, or all the responsibilities arising therefrom, as a result of any investment behavior.<\/em><\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>Comparison of TSMC, Intel, and Samsung\u2019s new process roadmaps for future chips<\/p>\n","protected":false},"author":1,"featured_media":11795,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[110,490,483],"tags":[168,778,41,1283,1345,260],"class_list":["post-5050","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-semiconductor","category-entry-barrier","category-price-power","tag-ibm","tag-imec","tag-intc","tag-rapidus","tag-siuif","tag-tsm"],"_links":{"self":[{"href":"https:\/\/www.granitefirm.com\/blog\/us\/wp-json\/wp\/v2\/posts\/5050","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.granitefirm.com\/blog\/us\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.granitefirm.com\/blog\/us\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.granitefirm.com\/blog\/us\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.granitefirm.com\/blog\/us\/wp-json\/wp\/v2\/comments?post=5050"}],"version-history":[{"count":152,"href":"https:\/\/www.granitefirm.com\/blog\/us\/wp-json\/wp\/v2\/posts\/5050\/revisions"}],"predecessor-version":[{"id":41905,"href":"https:\/\/www.granitefirm.com\/blog\/us\/wp-json\/wp\/v2\/posts\/5050\/revisions\/41905"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.granitefirm.com\/blog\/us\/wp-json\/wp\/v2\/media\/11795"}],"wp:attachment":[{"href":"https:\/\/www.granitefirm.com\/blog\/us\/wp-json\/wp\/v2\/media?parent=5050"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.granitefirm.com\/blog\/us\/wp-json\/wp\/v2\/categories?post=5050"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.granitefirm.com\/blog\/us\/wp-json\/wp\/v2\/tags?post=5050"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}