TSMC’s semiconductor packaging-related financial revenue indicators at the third quarter of 2024 are as follows: In the second quarter of 2024, packaging business-related revenue reached US$2.4 billion. In the third quarter of 2024, revenue related to the packaging business reached US$3.2 billion, a quarterly increase of 36%. CoWoS packaging production capacity will double in 2024.
Tag: AMKR
Semiconductor packaging market is undergoing fundamental changes
The more they enter the high-end process, these traditional global semiconductor packaging and testing plants (OSAT) gradually show their weaknesses – they are no longer able to enjoy the previous advantages in the field of high-end semiconductor process.
The lucrative semiconductor supply chain
The lucrative semiconductor supply chain