TSMC’s semiconductor packaging-related financial revenue indicators at the third quarter of 2024 are as follows: In the second quarter of 2024, packaging business-related revenue reached US$2.4 billion. In the third quarter of 2024, revenue related to the packaging business reached US$3.2 billion, a quarterly increase of 36%. CoWoS packaging production capacity will double in 2024.
Tag: TSMC
A series of Intel decisions led to where it is today
In Intel’s sixty years, the company has only had eight CEOs. But there are only two kinds of these eight: extremely good and terrible. The performance of these two types of Intel CEOs can be said to be very different: Intel decisions during their respective tenures resulted in the current miserable state of Intel we see.
Schmidt’s removed speech deserves investors to read. What did it talk about?
It’s okay if Schmidt’s not removed, maybe no one will find out. As soon as it was removed, it immediately aroused the curiosity and interest of many people. I spent some time and found a video copy of this speech, as well as a verbatim transcript of the original speech.
Gen 3 semiconductor
Gen 3 semiconductor are a very new field in terms of the entire “The lucrative semiconductor supply chain”.
The gap between China and US, is all China-made software and hardware possible?
The technology gap between China and US, On 5/6/2022, there was a news report that Beijing ordered central government agencies, state-owned enterprises and government-related enterprises or institutions to replace the currently used foreign brand computers with domestic equipment.
Global semiconductor chip market in detail, big dominators and markets
Mastering the flow of products and market conditions is the fastest way to understand the industry. The semiconductor wafer industry is no different.
The failed Taiwan software industry policy
The failed Taiwan software industry policy