It was AMD that truly brought HBM from research paper to product. SK Hynix successfully developing the first generation of HBM.
Tag: SSNLF
Sandisk soared 50-fold in 1.5 years, driven by AI demand
SanDisk’s timing has been precise, coinciding perfectly with the massive demand for memory and storage chips driven by artificial intelligence. In less than a year and a half, its stock price has increased 50 times (not 50%).
SK Hynix dominates memory by AI
2012, SK Group, South Korea’s third-largest conglomerate, announced the acquisition of a 21.05% stake in Hynix, taking control of the memory chip giant. Hynix then separated from the Hyundai Group and added “SK” to its official name, becoming the SK Hynix we know today.
SkyWater, 3D chip leader and the only pure-play US chip foundry
SkyWater is currently the only company that it fully controls, with all its factories located in the United States, and it is a pure-play foundry. 3D chips are the absolute core of DARPA’s Electronics Resurgence Initiative (ERI). SkyWater, the project’s implementer, will collaborate with MIT and Stanford University to turn the 3D chip research and development concept into a reality capable of large-scale industrial production within the next three years.
China is monopolizing world’s chip mature process
China’s mature process chip capacity will account for about 28% of the global market by 2025, according to IDC estimates, and industry association SEMI says that figure could grow to 39% by 2027
How is SMIC after US embargo?
SMIC after US embargo, forced to use DVU, SMIC adopted the N+2 process and was able to produce advanced AI chips for China withou EUV. The yield rate of Ascend 910C made by SMIC has increased from 20% a year ago to 40% that can make money.
TSMC is becoming the lord of semiconductor packaging, in addition to foundry
TSMC’s semiconductor packaging-related financial revenue indicators at the third quarter of 2024 are as follows: In the second quarter of 2024, packaging business-related revenue reached US$2.4 billion. In the third quarter of 2024, revenue related to the packaging business reached US$3.2 billion, a quarterly increase of 36%. CoWoS packaging production capacity will double in 2024.
Semiconductor packaging market is undergoing fundamental changes
The more they enter the high-end process, these traditional global semiconductor packaging and testing plants (OSAT) gradually show their weaknesses – they are no longer able to enjoy the previous advantages in the field of high-end semiconductor process.
How does Onto make money? Advanced packaging beneficiary
Advanced chip manufacturing processes will make packaging and testing more and more difficult than previous mature processes. Onto provides yield improvement tools for HBM necessary for advanced packaging and artificial intelligence chips.
Is Microsoft’s personal computer computing department a tasteless one?
Microsoft’s personal computer computing department includes Windows, Surface devices, Xbox, games, search engine Bing.