TSMC is becoming the lord of semiconductor packaging, in addition to foundry

TSMC’s semiconductor packaging-related financial revenue indicators at the third quarter of 2024 are as follows: In the second quarter of 2024, packaging business-related revenue reached US$2.4 billion. In the third quarter of 2024, revenue related to the packaging business reached US$3.2 billion, a quarterly increase of 36%. CoWoS packaging production capacity will double in 2024.

The reasons behind Broadcom share price consistantly outperformance

“99% of all internet traffic crosses through some type of Broadcom technology”, Broadcom said. The reason behind the long-term continued outperformance of Broadcom share price is that I vote for Broadcom CEO Hock E. Tan.

A series of Intel decisions led to where it is today

In Intel’s sixty years, the company has only had eight CEOs. But there are only two kinds of these eight: extremely good and terrible. The performance of these two types of Intel CEOs can be said to be very different: Intel decisions during their respective tenures resulted in the current miserable state of Intel we see.

error: Content is protected !!