TSMC is becoming the lord of semiconductor packaging, in addition to foundry

TSMC’s semiconductor packaging-related financial revenue indicators at the third quarter of 2024 are as follows: In the second quarter of 2024, packaging business-related revenue reached US$2.4 billion. In the third quarter of 2024, revenue related to the packaging business reached US$3.2 billion, a quarterly increase of 36%. CoWoS packaging production capacity will double in 2024.

The gap between China and US, is all China-made software and hardware possible?

The technology gap between China and US, On 5/6/2022, there was a news report that Beijing ordered central government agencies, state-owned enterprises and government-related enterprises or institutions to replace the currently used foreign brand computers with domestic equipment.

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