The focus of this post is a breakthrough from “Zyvex and sub-nanometer”.
TSMC discussion in my books
I have discussed the company Nvidia (ticker:NVDA) in two recent books; including:
In my book “The Rules of Super Growth Stocks Investing“:
- Sections 2-4, the entire section is dedicated to introducing the company TSMC
- Section 3-3, analyze the business development of technology companies to grasp the pulse of key industries
In my book “The Rules of 10 Baggers“:
- Section 3-2, the entire section is dedicated to introducing TSMC and the global semiconductor supply chain.
The Past, Present, and Future of Semiconductor Manufacturing
Roadmap and timeline for semiconductor manufacturers through 2025
In my blog’s “Comparison of TSMC, Samsung, Intel’s Yield and Advanced Process“, which is read by many people, I have detailed the process roadmap and schedule of the three major semiconductor manufacturers in the past, at present, and by 2025.
What about process two nanometers and below?
Because the current roadmap and schedule released by the three major semiconductor manufacturers only talk about 2nm, many readers have been asking about the future of 2nm? Therefore, I added a paragraph for “What about process two nanometers and below?” there.
What about sub-nanometers?
Human dependence on and demand for semiconductors force the industry to pursue more advanced technology and production capacity. For semiconductors, the breakthrough of the process is the main technical obstacle. The development of technology is changing with each passing day. The purpose of this article is to introduce various sub-nanometers, that is, the progress of semiconductor manufacturing below 1 nanometer.
The IMEC and ASML team
IMEC
The Belgian Microelectronics Research Center (IMEC), the “brain behind the global semiconductor industry”, said that with Moore’s Law, with the cooperation of new technologies, there is no problem in how many generations of advanced manufacturing processes are advanced. IMEC mentioned that the 1-nanometer process needs to move forward for four generations. At present, its roadmap has been scheduled and is expected to be realized in 2027, while the top 0.7-nanometer process is expected to be mass-produced after 2029.
ASML
The chief technology officer of ASML (ticker: ASML) has announced that in 2023, each High-NA EUV lithography machine with a price of about 400 million US dollars will be delivered to three major customers, including TSMC (ticker: TSM), Intel (ticker: INTC) and Samsung. This is the necessary equipment below 2 nanometers, for the existing semiconductor manufacturing technology.
Note: For ASML, please refer to my previous blog article “ASML, who dominate TSMC’s fate“
Zyvex Labs
Zyvex’s breakthrough
On September 21, 2022, Zyvex Labs announced the launch of the world’s highest-resolution lithography system, the ZyvexLitho1. Announced the successful creation of a lithography system for 0.7nm wafers.
The technology behind
According to Zyvex’s official website, the newly launched ZyvexLitho1 lithography system is a device based on Scanning Tunneling Microscopy (STM: Scanning Tunneling Microscopy). A 768-mm, or 0.7-nanometer chip, is equivalent to the width of 2 silicon atoms, making it the most precise lithography system in the world. While this wafer is mainly used in quantum computers, the quantum physics technology behind it is mainly used to achieve atomic precision patterning and sub-nanometer (768 picometers────Si (100) 2×1 dimer row width) resolution.
The lithography system that achieves this 0.7 nm resolution is a process called hydrogen depassivation lithography, a type of electron beam lithography (EBL) that achieves atomic resolution.
Electron beam lithography (often abbreviated EBL) is the practice of scanning a focused electron beam to draw custom shapes on a surface covered with an electron-sensitive film called photoresist (exposure). The electron beam alters the solubility of the photoresist, and by dipping the resist in a solvent (developing), exposed or unexposed areas can be selectively removed. Like lithography, the purpose is to create very small structures in resist, which are then transferred to the substrate material, usually by etching.
The main advantage of electron beam lithography is that it can draw custom patterns with sub-nanometer resolution (direct writing). The high resolution and low throughput of this form of maskless lithography limit its use in photomask fabrication, low-volume production of semiconductor devices, and research and development.
Mainly used in quantum computers
The machine’s uses include making extremely precise structures for quantum dot-based qubits to achieve the highest possible qubit quality. At present, the chips produced by the ZyvexLitho1 system are mainly used in quantum computers, which can create highly precise solid-state quantum components, as well as nano-components and materials. Precision is very important for quantum computers. This major breakthrough has made the function of “quantum computer” greatly breakthrough.
Note: Regarding quantum computers, please refer to my previous blog article “Quantum computing current progress and related stocks“
Areas of benefit
And several advanced industries that rely on quantum computers or ultra-high-speed computer computing can benefit from a substantial breakthrough in the capabilities of “quantum computers”.
Areas of these advanced industries include:
- Data encryption is more secure.
- Quantum communication is more secure.
- Significant reduction in time required for drug discovery
- Provide and more accurate weather forecast
Disadvantages of Zyvex Technology
Zyvex said it can already accept other customer orders, and the machine will ship in about six months.
However, the disadvantage of this technology is that the output is very low, and it cannot meet the needs of large-scale manufacturing of chips. It is only suitable for small-scale production and cannot meet the large-scale demand for chips in the market. It seems that it does not pose a threat to TSMC. Moore’s position is irreplaceable.
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