Investors who want to seriously study TSMC must want to know how many wafer fabrication foundry (aka fabs) and assembly and testing house TSMC currently and in the future have? The information of this article is that I have spent some time until today, based on TSMC’s annual report, company website, and news reports in both Chinese and English media.
TSMC discussion in my books
I have discussed the company Nvidia (ticker:NVDA) in two recent books; including:
In my book “The Rules of Super Growth Stocks Investing“:
- Sections 2-4, the entire section is dedicated to introducing the company TSMC
- Section 3-3, analyze the business development of technology companies to grasp the pulse of key industries
In my book “The Rules of 10 Baggers“:
- Section 3-2, the entire section is dedicated to introducing TSMC and the global semiconductor supply chain.
Capacity expansion
In 2022, TSMC announced in a public technical conference:
- The rate of factories construction has increased from 2 per year in 2017 to 2019 to 6 per year in 2020 to 2022.
- Focus on the production capacity of 7, 5 and 3 nanometers in advanced processes, and increase at a compound growth rate of 70% from 2018 to 2022. The 5nm capacity will be four times what it was two years ago.
- Expand the special process production capacity, and the 12-inch special process production capacity will increase by 14% from 2021 to 2022.
Existing facilities
Wafer fabrication foundry (aka fab)
As of 2021, based on TSMC’s annual financial report and company website information, the wafer fabrication foundry (aka fab) in commercial operation are as follows:
| Wafer size (inch) | Number of fabs | Status | Country |
| 12 | 4 | Existing | Taiwan |
| 8 | 4 | Existing | Taiwan |
| 6 | 1 | Existing | Taiwan |
| 12 | 1 | Existing | China |
| 8 | 1 | Existing | China |
| 8 | 1 | Existing | US |
Assembly and testing house
| House name | Focus | Status | City | Country |
| Hsinchu assembly and testing house/AP1 | Testing and back-end packaging | Existing | Hsinchu | Taiwan |
| Tainan assembly and testing house/AP2 | Testing and front-end 3D Fabric | Existing | Tainan | Taiwan |
| Longtan assembly and testing house/AP3 | 3D Fabric | Existing | Longtan | Taiwan |
| Taichung assembly and testing house/AP5 | Testing and back-end packaging | Existing | Taichung | Taiwan |
| Xintec (TSMC has 41% stake) | 3D packaging of SoC | Existing | Taoyuan | Taiwan |
Facilities built and planned after 2022
Advanced process foundry (aka fab)
| Fab name/phase | Process | Status | City | Country |
| Tainan Fab 14/P8 | 12/16 nm, special process | Existing | Tainan | Taiwan |
| Taichung Fab 15 | 6/7/10/22/28 nm | Existing | Taichung | Taiwan |
| Nanjing Fab 16 | 12/16 nm, 22/28 nm | Existing | Nanjing | Taiwan |
| Tainan Fab 18//P4- P9 | 3nm, 4/5nm | On production | Tainan | Taiwan |
| Tainan Fab 14/P8 | Special process | In planning | Tainan | Taiwan |
| Hsinchu Fab 12/P7-P8 | 3nm, Global development center | Completed in 2021 | Hsinchu | Taiwan |
| Hsinchu Fab 12/P8 | Development center | In planning | Hsinchu | Taiwan |
| Hsinchu Fab 20/P1-P5 | 2 nm | Under construction | Hsinchu | Taiwan |
| Taichung Fab 15 | 2 nm | Confirmed | Taichung | Taiwan |
| Nanzi fab/P1 | 28 nm | Delayed | Kaohsiung | Taiwan |
| Nanzi Fab 22 | 2 nm | Production in 2025 | Kaohsiung | Taiwan |
| Nanzi fab/P3 | 2 nm | Confirmed | Kaohsiung | Taiwan |
| Taichung fab | 1.4 nm | High possibility | Taichung | Taiwan |
| Japan fab 1 (Fab 23) | 12/16/22/28 nm | Production in 2024 | Kumamoto | Japan |
| Japan fab 2 | 6/7/40 nm | Production in 2028 | Kumamoto | Japan |
| Japan fab 3 | 3nm | TBD | Kumamoto | Japan |
| US fab 21/P1 | 4nm | Production in 2025 | Arizona | US |
| US fab 21/P2 | 3 nm | Production in 2028 | Arizona | US |
| US fab 21/P3 | 2 nm | Production in 2030 | Arizona | US |
| Germany fab (ESMC) | 22/28 nm, to upgrade to 12/16 nm | Production in 2027 | Dresden | Germany |
Advanced assembly and testing house
| Fab name/phase | Focus | Status | City | Country |
| Zhunan assembly and testing house/AP6 | Back-end 3D packaging, 3D Fabric, SoIC, InFO | 2023 production | Zhunan | Taiwan |
| Tainan assembly and testing house/AP2C | Font-end 3D packaging , testing | 2023 production | Tainan | Taiwan |
| US assembly and testing house | Advanced packaging, 3D stacking technology | In planning | Arizona | US |
| Chiayi assembly and testing house/AP7 | CoWoS/SoIC advanced packaging, Font-end 3D packaging , testing | 2026 | Chiayi | Taiwan |
| Chiayi assembly and testing house/AP5 | CoWoS advanced packaging | 2025 | Taichung | Taiwan |
| Tongluo Advanced Packaging and Testing Plant | CoWoS advanced packaging | 2027 | Miaoli | Taiwan |
| Japan assembly and testing house | CoWoS advanced packaging | Japan |
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