TSMC is becoming the lord of semiconductor packaging, in addition to foundry

TSMC’s semiconductor packaging-related financial revenue indicators at the third quarter of 2024 are as follows: In the second quarter of 2024, packaging business-related revenue reached US$2.4 billion. In the third quarter of 2024, revenue related to the packaging business reached US$3.2 billion, a quarterly increase of 36%. CoWoS packaging production capacity will double in 2024.

The evil power, How did Japan, Alstom, Toshiba, Via, HTC and Taiwan’s panel industry collapse ?

Power contry basically does not allow any country in the world to lead it. It only allows US to set fires, but does not allow others to light lamps.

The gap between China and US, is all China-made software and hardware possible?

The technology gap between China and US, On 5/6/2022, there was a news report that Beijing ordered central government agencies, state-owned enterprises and government-related enterprises or institutions to replace the currently used foreign brand computers with domestic equipment.

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