In 1984, Philips spun off its photolithography division and became ASML. Due to backward technology, the EUV lithography machine that Intel has developed for many years has not yet been launched, and it has been decided not to have an EUV lithography machine made by an American company.
Category: Semiconductor
How was TSMC originally founded? Not by Morris Chang
The real founder of TSMC should be the Taiwanese government in the 1970s and 1980s, and several very visionary economic bureaucrats who came up with the idea; it was not Morris Chang.
TSMC Advanced Packaging Evolution History
In 2009, with Morris Chang’s approval, Shang-yi Chiang started the research and development of TSMC advanced packaging technology with an investment of US$100 million in equipment and a team of more than 400 engineers.
Why is TSMC valuation much lower than US peers?
When large-scale investment institutions in the United States consider the TSMC valuation, they use the perspective and starting point of the United States to compare TSMC with its local semiconductor peers in the United States
TSMC is becoming the lord of semiconductor packaging, in addition to foundry
TSMC’s semiconductor packaging-related financial revenue indicators at the third quarter of 2024 are as follows: In the second quarter of 2024, packaging business-related revenue reached US$2.4 billion. In the third quarter of 2024, revenue related to the packaging business reached US$3.2 billion, a quarterly increase of 36%. CoWoS packaging production capacity will double in 2024.
TSMC Morris Chang’s controversial words and deeds
Taiwan government invested only NT$5.5 billion in TSMC, accounting for about 48% of the shares. This is why TSMC founder Morris Chang later said that the government only invested a small amount of money. Morris Chang’s remarks are typical of taking advantage of others.
Comparison of AI chips GPU and ASIC
GPU and ASIC, by 2028, the total market size of AI accelerators will reach US$380 billion, of which AI GPUs will dominate with a 75% share, and ASICs will account for only 25%.
Semiconductor packaging market is undergoing fundamental changes
The more they enter the high-end process, these traditional global semiconductor packaging and testing plants (OSAT) gradually show their weaknesses – they are no longer able to enjoy the previous advantages in the field of high-end semiconductor process.
The reasons behind Broadcom share price consistantly outperformance
“99% of all internet traffic crosses through some type of Broadcom technology”, Broadcom said. The reason behind the long-term continued outperformance of Broadcom share price is that I vote for Broadcom CEO Hock E. Tan.
Advanced Packaging is semiconductor’s next golden goose
Yole: the advanced packaging market is expected to have a compound annual growth rate of 11% from 2023 to 2029, and the market size will expand to US$69.5 billion.